Standard No.:	GB/T 29507-2013
English Name:	Test method for measuring flatness, thickness and total thickness vsriation on silicon wafers. Automated non-contact scanning
Chinese Name:	硅片平整度、厚度及总厚度变化测试 自动非接触扫描法
Chinese Classification:	H80    Semimetal and semiconductor material in general
Professional Classification:	GB    National Standard
ICS Classification:	29.045 29.045    Semiconducting materials 29.045
Issued by:	AQSIQ; SAC
Issued on:	2013-05-09
Implemented on:	2014-2-1
Status:	valid
Language:	English
File Format:	PDF
Word Count:	7500 words
Price(USD):	260.0
Delivery:	via email in 1~3 business day

本标准规定了直径不小于50 mm，厚度不小于100 μm的切割、研磨、腐蚀、抛光、外延或其他表面状态的硅片平整度、厚度及总厚度变化的测试。
本标准为非破坏性、无接触的自动扫描测试方法，适用于洁净、干燥硅片的平整度和厚度测试，且不受硅片的厚度变化、表面状态和硅片形状的影响。