GB 51136-2015 Code for design of thin film transistor liquid crystal display plant
1. General provisions
1.0.1 This code is prepared with a view to implement the relevant national laws and regulations in thedesign of the thin film transistor liquid crystal display (TFT-LCD) plant, to meet the productionrequirements of the thin film transistor liquid crystal display, to ensure the safety of personal andproperty, to achieve safety and reliability, energy saving and environmental protection, advancedtechnology,cost-effectiveness and quality assurance.1.0.2 This code is applicable to the engineering design of new construction,renovation and extensionof thin film transistor liquid crystal display plants.1.0.3 In addition to the requirements in this code, the design of the thin film transistor liquid crystaldisplay (TFT-LCD)plant shall also meet the reguirements of the current relevant standards of thenation.
2. Terms
2.0.1 Thin film transistor liquid crystal display(TFT-LCD)Liquid crystal display with pixel driven directly by active matrix and using thin-film transistors ascontrol pixel switches.
2.0.2 Automated material handling system(AMHS)The system that a series of related automation tools and device coordinately and reasonablymoving,storing and controlling material in a process or logical action system .
2.0.3 Glass substrate
The basic part of liquid crystal display that composed of thin glass sheet with an extremely flatsurface.
2.0.4 ArrayThe process to fabricate regular array of specific thin film transistors (switching devices)to formdata lines, storage capacitors and signal lines by coating, photolithography etching and othersemiconductor process technologies on a glass substrate.
2.0.5 Color filter(CF)The filters with three primary colors of red, green and blue arranged regularly on a transparentsubstrate to pass only the required color light ,also known as color filters.
2.0.6 Cell
The liquid crystal celf(screen)process of assembling the prepared Array glass substrate and CFglass substrate of the thin film transistor liquid crystal display together, filling liquid crystal into thespace between two glass substrates ,and adding an adapted'electric field to display images.
2.0.7 Space management
The design of the coordination between various disciplines for as large as the building layout of theentire plant site, underground piping or as small as an individual building in order to effectively use thespace and shorten the work process.
2.0.8 Dry etching processThe method of etching substrate surface and etched substance in gas phase.
2.0.9 Plasma enhanced chemical vapor deposition(PECVD)The reaction of carrying out chemical vapor deposition at lower temperature by utilizing theactivity promoting reaction of plasma.
3. Basic requirements
3.0.1 The design of the TFT-LCD plant shall use resources reasonably, protect the environment,prevent and reduce the pollution and harm of waste gas , waste water, waste chemical, waste residue,dust, noise, vibration and electromagnetic radiation generated in the production and constructionactivities to the environment.
3.0.2 The design of the TFT-LCD plant shall be in accordance with the ollowing requirements:1According to the characteristics of the production process,new technologies, new equipmentand new materials for energy conservation and environmental protection shall be adopted.Shall meet the requirements of tools installation, commissioning and overhaul, safety2production,and maintenance management.
Measures shall be taken to meet the requirements of fire safety.3
Energy saving measures shall be taken.
Shall meet the requirement of huge space and clean environment for the production of TFT-LCD.
The design capability of the TFT-L.CD production line shall be in accordance with the3,0.3requirements of economic cale, and/ the design shall reserve conditions for future productiondevelopment or process improvement according to the enterprise development plan.
4. Process design
4.1 Generalrequirements
4.1.1 The process design shall be in accordance with the following requirements :
1 Shall ensure production efficiency and product quality.
2 Shall prevent and reduce the damage and harm to workers' health caused by occupationaldisease hazards,and reduce the labor intensity of workers.
3 Shall be flexible and adaptable.4Shall be beneficial to reduce engineering construction cost and running cost.
4.1.2 The production space and layout, production environment parameters and utility supplydetermined in the process design shall meet the requirements of process , and the necessary conditionsshall be reserved for the upgrade and transformation ofproduction technology.
4.1.3 The production department directly related to the production process should adopt acontinuously running production organization method , and the work shifts of other auxiliary productiondepartments may be determined according to production needs.
Basic processThe production process may be determined according to the contents of procedures of the
4.2.1various process listed in Appendix A of this code.4.2.2 The main production process shall be complete and match,Array,CF and Cell process should beset in the samc plant
4.2.3 The auxiliary production and technical service facilities related to the main production process
shall be set up in the plant.
4.3 Process layout4.3.1 The process layout of the key production area of Array,CF and Cell shall be in accordance withthe following requirements:
1 The combination of process layout shall be according to the process characteristics andenvironmental requirements,and the multiple-storey arrangement should be adopted.
The process layout shall prevent the effects of vibration, electromagnetic radiation, heatradiation and air pollution between process tools
3The entrances of people and logistics into the production area shall be set up separately,and the
corresponding clean facilities for personal and material shall be set up.4 The production area shall be equipped with equipment move in entrances and passage:Equipment lifting and loading platforms shall be installed when the installation height of the equipmentin the production area is 1.5m higher than outside floor
Standard
GB 51136-2015 Code for design of thin film transistor liquid crystal display plant (English Version)
Standard No.
GB 51136-2015
Status
valid
Language
English
File Format
PDF
Word Count
42500 words
Price(USD)
1275.0
Implemented on
2016-6-1
Delivery
via email in 1~2 business day
Detail of GB 51136-2015
Standard No.
GB 51136-2015
English Name
Code for design of thin film transistor liquid crystal display plant
GB 51136-2015 Code for design of thin film transistor liquid crystal display plant
1. General provisions
1.0.1 This code is prepared with a view to implement the relevant national laws and regulations in thedesign of the thin film transistor liquid crystal display (TFT-LCD) plant, to meet the productionrequirements of the thin film transistor liquid crystal display, to ensure the safety of personal andproperty, to achieve safety and reliability, energy saving and environmental protection, advancedtechnology,cost-effectiveness and quality assurance.1.0.2 This code is applicable to the engineering design of new construction,renovation and extensionof thin film transistor liquid crystal display plants.1.0.3 In addition to the requirements in this code, the design of the thin film transistor liquid crystaldisplay (TFT-LCD)plant shall also meet the reguirements of the current relevant standards of thenation.
2. Terms
2.0.1 Thin film transistor liquid crystal display(TFT-LCD)Liquid crystal display with pixel driven directly by active matrix and using thin-film transistors ascontrol pixel switches.
2.0.2 Automated material handling system(AMHS)The system that a series of related automation tools and device coordinately and reasonablymoving,storing and controlling material in a process or logical action system .
2.0.3 Glass substrate
The basic part of liquid crystal display that composed of thin glass sheet with an extremely flatsurface.
2.0.4 ArrayThe process to fabricate regular array of specific thin film transistors (switching devices)to formdata lines, storage capacitors and signal lines by coating, photolithography etching and othersemiconductor process technologies on a glass substrate.
2.0.5 Color filter(CF)The filters with three primary colors of red, green and blue arranged regularly on a transparentsubstrate to pass only the required color light ,also known as color filters.
2.0.6 Cell
The liquid crystal celf(screen)process of assembling the prepared Array glass substrate and CFglass substrate of the thin film transistor liquid crystal display together, filling liquid crystal into thespace between two glass substrates ,and adding an adapted'electric field to display images.
2.0.7 Space management
The design of the coordination between various disciplines for as large as the building layout of theentire plant site, underground piping or as small as an individual building in order to effectively use thespace and shorten the work process.
2.0.8 Dry etching processThe method of etching substrate surface and etched substance in gas phase.
2.0.9 Plasma enhanced chemical vapor deposition(PECVD)The reaction of carrying out chemical vapor deposition at lower temperature by utilizing theactivity promoting reaction of plasma.
3. Basic requirements
3.0.1 The design of the TFT-LCD plant shall use resources reasonably, protect the environment,prevent and reduce the pollution and harm of waste gas , waste water, waste chemical, waste residue,dust, noise, vibration and electromagnetic radiation generated in the production and constructionactivities to the environment.
3.0.2 The design of the TFT-LCD plant shall be in accordance with the ollowing requirements:1According to the characteristics of the production process,new technologies, new equipmentand new materials for energy conservation and environmental protection shall be adopted.Shall meet the requirements of tools installation, commissioning and overhaul, safety2production,and maintenance management.
Measures shall be taken to meet the requirements of fire safety.3
Energy saving measures shall be taken.
Shall meet the requirement of huge space and clean environment for the production of TFT-LCD.
The design capability of the TFT-L.CD production line shall be in accordance with the3,0.3requirements of economic cale, and/ the design shall reserve conditions for future productiondevelopment or process improvement according to the enterprise development plan.
4. Process design
4.1 Generalrequirements
4.1.1 The process design shall be in accordance with the following requirements :
1 Shall ensure production efficiency and product quality.
2 Shall prevent and reduce the damage and harm to workers' health caused by occupationaldisease hazards,and reduce the labor intensity of workers.
3 Shall be flexible and adaptable.4Shall be beneficial to reduce engineering construction cost and running cost.
4.1.2 The production space and layout, production environment parameters and utility supplydetermined in the process design shall meet the requirements of process , and the necessary conditionsshall be reserved for the upgrade and transformation ofproduction technology.
4.1.3 The production department directly related to the production process should adopt acontinuously running production organization method , and the work shifts of other auxiliary productiondepartments may be determined according to production needs.
Basic processThe production process may be determined according to the contents of procedures of the
4.2.1various process listed in Appendix A of this code.4.2.2 The main production process shall be complete and match,Array,CF and Cell process should beset in the samc plant
4.2.3 The auxiliary production and technical service facilities related to the main production process
shall be set up in the plant.
4.3 Process layout4.3.1 The process layout of the key production area of Array,CF and Cell shall be in accordance withthe following requirements:
1 The combination of process layout shall be according to the process characteristics andenvironmental requirements,and the multiple-storey arrangement should be adopted.
The process layout shall prevent the effects of vibration, electromagnetic radiation, heatradiation and air pollution between process tools
3The entrances of people and logistics into the production area shall be set up separately,and the
corresponding clean facilities for personal and material shall be set up.4 The production area shall be equipped with equipment move in entrances and passage:Equipment lifting and loading platforms shall be installed when the installation height of the equipmentin the production area is 1.5m higher than outside floor