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Position: Chinese Standard in English/GB/T 14664-1993
GB/T 14664-1993   Dimensional tolerances stipulation of plastic packaging mould (English Version)
Standard No.: GB/T 14664-1993 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 2500 words Translation Price(USD):220.0 remind me the price change

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Implemented on:1994-7-1 Delivery: via email in 1~3 business day

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,2007-9-1,1994-7-1,26257DDBCB7582A81513905312230
Standard No.: GB/T 14664-1993
English Name: Dimensional tolerances stipulation of plastic packaging mould
Chinese Name: 塑封模具尺寸公差规定
Chinese Classification: K15    Electrical insulating material and its products
Professional Classification: GB    National Standard
ICS Classification: 25.120.30 25.120.30    Moulding equipment 25.120.30
Source Content Issued by: SBTS
Issued on: 1993-10-16
Implemented on: 1994-7-1
Status: superseded
Superseded by:GB/T 14663-2007 Specification of plastic packaging moulds
Superseded on:2007-9-1
Target Language: English
File Format: PDF
Word Count: 2500 words
Translation Price(USD): 220.0
Delivery: via email in 1~3 business day
本规范规定了塑封模具中直接影响产品质量的尺寸公差定义、公差极限和检测方法。本标准适用于塑料封装的集成电路、半导体分立器件和件等塑料模具。封装材料为热固性塑料,如改性环氧树脂、硅酮塑料等。
Code of China
Standard
GB/T 14664-1993  Dimensional tolerances stipulation of plastic packaging mould (English Version)
Standard No.GB/T 14664-1993
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count2500 words
Price(USD)220.0
Implemented on1994-7-1
Deliveryvia email in 1~3 business day
Detail of GB/T 14664-1993
Standard No.
GB/T 14664-1993
English Name
Dimensional tolerances stipulation of plastic packaging mould
Chinese Name
塑封模具尺寸公差规定
Chinese Classification
K15
Professional Classification
GB
ICS Classification
Issued by
SBTS
Issued on
1993-10-16
Implemented on
1994-7-1
Status
superseded
Superseded by
GB/T 14663-2007 Specification of plastic packaging moulds
Superseded on
2007-9-1
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
2500 words
Price(USD)
220.0
Keywords
GB/T 14664-1993, GB 14664-1993, GBT 14664-1993, GB/T14664-1993, GB/T 14664, GB/T14664, GB14664-1993, GB 14664, GB14664, GBT14664-1993, GBT 14664, GBT14664
Introduction of GB/T 14664-1993
本规范规定了塑封模具中直接影响产品质量的尺寸公差定义、公差极限和检测方法。本标准适用于塑料封装的集成电路、半导体分立器件和件等塑料模具。封装材料为热固性塑料,如改性环氧树脂、硅酮塑料等。
Contents of GB/T 14664-1993
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Keywords:
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