GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices (English Version)
Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices
GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
1 Scope
This document specifies dimensions and physical properties of chassis and associated printed boards in order to provide mechanical and environmental integrity for embedded computing devices. They are used in various applications such as machine control, medical, transportation, aerospace and telecommunication, typically based on single board computers.
For the easy definition of the suitable chassis and associated single board dimensions, this document is based on a structural grid of 44.45 mm (1.75 in).
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60297-3-100 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
Note: GB/T 19520.16-2015, Mechanical structures for electronic equipment - Dimension of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008, IDT)
IEC 60529 Degrees of protection provided by enclosures (IP Code)
Note: GB/T 4208-2017, Degrees of protection provided by enclosure (IP code) (IEC 60529:2013, IDT)
IEC 61587-1 Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects
Note: GB/T 18663.1-2008, Mechanical structures for electronic equipment tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007, IDT)
IEC 61587-3 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
Note: GB/T 18663.3-2020, Mechanical structures for electronic equipment - Tests for metric and inch system - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (IEC 61587-3:2013, IDT)
IEC 61587-5 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks, and plug-in units
Note: GB/T 18663.5-2022, Mechanical structures for electronic equipment - Tests for metric and inch system - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013, IDT)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
chassis for embedded computing
mechanical structure designed to support associated electric and electronic components
4 Arrangement overview
Figure 1 illustrates a typical chassis arrangement.
5 Chassis dimensions
The chassis dimensions are based on a structural grid of 44.45 mm (1.75 in). Figure 2 and Figure 3 illustrate the chassis width, height and depth dimensions. See also Tables 1 to 3.
The printed board dimensions shall comply with the provisions of Appendix A. The printed board dimensions with fan cooling shall comply with the provisions of Appendix B. The installation options for the chassis shall comply with the provisions of Appendix C. The environmental tests shall comply with the provisions of Appendix D. The extended chassis dimensions See Appendix E.
Standard
GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices (English Version)
Standard No.
GB/T 19520.21-2023
Status
valid
Language
English
File Format
PDF
Word Count
12500 words
Price(USD)
375.0
Implemented on
2024-6-1
Delivery
via email in 1~5 business day
Detail of GB/T 19520.21-2023
Standard No.
GB/T 19520.21-2023
English Name
Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices
GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
1 Scope
This document specifies dimensions and physical properties of chassis and associated printed boards in order to provide mechanical and environmental integrity for embedded computing devices. They are used in various applications such as machine control, medical, transportation, aerospace and telecommunication, typically based on single board computers.
For the easy definition of the suitable chassis and associated single board dimensions, this document is based on a structural grid of 44.45 mm (1.75 in).
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60297-3-100 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
Note: GB/T 19520.16-2015, Mechanical structures for electronic equipment - Dimension of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008, IDT)
IEC 60529 Degrees of protection provided by enclosures (IP Code)
Note: GB/T 4208-2017, Degrees of protection provided by enclosure (IP code) (IEC 60529:2013, IDT)
IEC 61587-1 Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects
Note: GB/T 18663.1-2008, Mechanical structures for electronic equipment tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007, IDT)
IEC 61587-3 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
Note: GB/T 18663.3-2020, Mechanical structures for electronic equipment - Tests for metric and inch system - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (IEC 61587-3:2013, IDT)
IEC 61587-5 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks, and plug-in units
Note: GB/T 18663.5-2022, Mechanical structures for electronic equipment - Tests for metric and inch system - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013, IDT)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
chassis for embedded computing
mechanical structure designed to support associated electric and electronic components
4 Arrangement overview
Figure 1 illustrates a typical chassis arrangement.
5 Chassis dimensions
The chassis dimensions are based on a structural grid of 44.45 mm (1.75 in). Figure 2 and Figure 3 illustrate the chassis width, height and depth dimensions. See also Tables 1 to 3.
The printed board dimensions shall comply with the provisions of Appendix A. The printed board dimensions with fan cooling shall comply with the provisions of Appendix B. The installation options for the chassis shall comply with the provisions of Appendix C. The environmental tests shall comply with the provisions of Appendix D. The extended chassis dimensions See Appendix E.
