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| Position: Chinese Standard in English/GB/T 44517-2024 |
| GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films (English Version) | |||
| Standard No.: | GB/T 44517-2024 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 9000 words | Translation Price(USD): | 270.0 remind me the price change |
| Implemented on: | 2025-4-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 44517-2024 |
| English Name: | Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films |
| Chinese Name: | 微机电系统（MEMS）技术 MEMS膜残余应力的晶圆曲率和悬臂梁挠度试验方法 |
| Chinese Classification: | L59 Micromodule |
| Professional Classification: | GB National Standard |
| ICS Classification: | 31.080.99 Other semiconductor devices |
| Source Content Issued by: | SAMR, SAC |
| Issued on: | 2024-09-29 |
| Implemented on: | 2025-4-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 9000 words |
| Translation Price(USD): | 270.0 |
| Delivery: | via email in 1~3 business day |