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| Position: Chinese Standard in English/GB/T 8750-1997 |
| GB/T 8750-1997 Gold wire for semiconductor devices lead bonding (English Version) | |||
| Standard No.: | GB/T 8750-1997 | Status: | abolished remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 6000 words | Translation Price(USD): | 180.0 remind me the price change |
| Implemented on: | 1998-8-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 8750-1997 |
| English Name: | Gold wire for semiconductor devices lead bonding |
| Chinese Name: | 半导体器件键合金丝 |
| Chinese Classification: | H68 Precious metals and their alloys |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | STSB |
| Issued on: | 1997-01-02 |
| Implemented on: | 1998-8-1 |
| Status: | abolished |
| Superseded by: | GB/T 8750-2007 Gold bonding wire for semiconductor devices |
| Superseded on: | 2008-6-1 |
| Abolished on: | 2008-06-01 |
| Superseding: | GB 8750-1988 Cold wire for semiconductor lead bonding |
| Target Language: | English |
| File Format: | |
| Word Count: | 6000 words |
| Translation Price(USD): | 180.0 |
| Delivery: | via email in 1~3 business day |