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| Position: Chinese Standard in English/SJ 21546-2020 |
| SJ 21546-2020 Specification for laser leveling flip-chip bonder of infrared device manufacturing (English Version) | |||
| Standard No.: | SJ 21546-2020 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 10000 words | Translation Price(USD): | 300.0 remind me the price change |
| Implemented on: | 2020-8-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | SJ 21546-2020 |
| English Name: | Specification for laser leveling flip-chip bonder of infrared device manufacturing |
| Chinese Name: | 红外器件制造用激光调平倒装焊接机规范 |
| Professional Classification: | SJ Professional Standard - Electronics |
| Issued on: | 2020-06-03 |
| Implemented on: | 2020-8-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 10000 words |
| Translation Price(USD): | 300.0 |
| Delivery: | via email in 1~5 business day |