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| Position: Chinese Standard in English/SJ 21552-2020 |
| SJ 21552-2020 High density functional substrate--Technical requirement for multilayer hybrid Integration process (English Version) | |||
| Standard No.: | SJ 21552-2020 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 7000 words | Translation Price(USD): | 210.0 remind me the price change |
| Implemented on: | 2020-8-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | SJ 21552-2020 |
| English Name: | High density functional substrate--Technical requirement for multilayer hybrid Integration process |
| Chinese Name: | 高密度功能基板混合多层集成工艺技术要求 |
| Professional Classification: | SJ Professional Standard - Electronics |
| Issued on: | 2020-06-03 |
| Implemented on: | 2020-8-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 7000 words |
| Translation Price(USD): | 210.0 |
| Delivery: | via email in 1~3 business day |