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Position: Chinese Standard in English/SJ/T 10454-2020 |
SJ/T 10454-2020 Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits (English Version) | |||
Standard No.: | SJ/T 10454-2020 | Status: | valid remind me the status change
Email: |
Language: | English | File Format: | |
Word Count: | 6000 words | Price(USD): | 180.0 remind me the price change
Email: |
Implemented on: | 2021-4-1 | Delivery: | via email in 1~3 business day |
Standard No.: | SJ/T 10454-2020 |
English Name: | Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits |
Chinese Name: | 厚膜混合集成电路多层布线用介质浆料 |
Professional Classification: | SJ Professional Standard - Electronics |
Issued by: | MIIT |
Issued on: | 2020-12-9 |
Implemented on: | 2021-4-1 |
Status: | valid |
Superseding: | SJ/T 10454-1993 Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
Language: | English |
File Format: | |
Word Count: | 6000 words |
Price(USD): | 180.0 |
Delivery: | via email in 1~3 business day |
SJ/T 10454-2020 Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits (English Version) | |||
Standard No. | SJ/T 10454-2020 | ||
Status | valid | ||
Language | English | ||
File Format | |||
Word Count | 6000 words | ||
Price(USD) | 180.0 | ||
Implemented on | 2021-4-1 | ||
Delivery | via email in 1~3 business day |
Standard No. |
SJ/T 10454-2020 |
English Name |
Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits |
Chinese Name |
厚膜混合集成电路多层布线用介质浆料 |
Chinese Classification |
Professional Classification |
SJ |
ICS Classification |
Issued by |
MIIT |
Issued on |
2020-12-9 |
Implemented on |
2021-4-1 |
Status |
valid |
Superseded by |
Superseded on |
Abolished on |
Superseding |
SJ/T 10454-1993 Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
Language |
English |
File Format |
Word Count |
6000 words |
Price(USD) |
180.0 |
Keywords |
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Keywords: | ||
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