SJ/T 11550-2015 English Version, SJ/T 11550-2015 Tin-based solder dipping ribbon used for crystalline silicon photovoltaic (PV) modules (English Version)

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SJ/T 11550-2015 Tin-based solder dipping ribbon used for crystalline silicon photovoltaic (PV) modules (English Version)
Standard No.:	SJ/T 11550-2015	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	6000 words	Translation Price(USD):	254.0 remind me the price change Email:
Implemented on:	2016-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	SJ/T 11550-2015
English Name:	Tin-based solder dipping ribbon used for crystalline silicon photovoltaic (PV) modules
Chinese Name:	晶体硅光伏组件用浸锡焊带
Professional Classification:	SJ Professional Standard - Electronics
Source Content Issued by:	Ministry of Industry and Information Technology
Issued on:	2015-10-10
Implemented on:	2016-4-1
Status:	valid
Target Language:	English
File Format:	PDF
Word Count:	6000 words
Translation Price(USD):	254.0
Delivery:	via email in 1~3 business day

Standard

SJ/T 11550-2015 Tin-based solder dipping ribbon used for crystalline silicon photovoltaic (PV) modules (English Version)
Standard No.	SJ/T 11550-2015
Status	valid
Language	English
File Format	PDF
Word Count	6000 words
Price(USD)	254.0
Implemented on	2016-4-1
Delivery	via email in 1~3 business day

Detail of SJ/T 11550-2015

Standard No.

English Name

Chinese Name

Chinese Classification

Professional Classification

ICS Classification

Issued by

Issued on

Implemented on

Status

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Superseded on

Abolished on

Superseding

Language

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Word Count

Price(USD)

Keywords

Introduction of SJ/T 11550-2015

标准主要内容包括浸锡焊带的术语和定义、技术要求（铜基材、锡层、外观、尺寸公差、力学性能、电学性能、耐老化性能、玻璃强度）、试验方法、标志、包装、运输和贮存。

Contents of SJ/T 11550-2015

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