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Position: Chinese Standard in English/T/CIE 152-2022
T/CIE 152-2022   Test method and procedure for identification of physical characteristics of fake and counterfeit microelectronics devices (English Version)
Standard No.: T/CIE 152-2022 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 8500 words Translation Price(USD):255.0 remind me the price change

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Standard No.: T/CIE 152-2022
English Name: Test method and procedure for identification of physical characteristics of fake and counterfeit microelectronics devices
Chinese Name: 微电子器件假冒翻新物理特征识别方法与程序
Chinese Classification: L74    Program language
Professional Classification: T/    Social Organization Standard
Source Content Issued by: CIE
Issued on: 2022-12-31
Status: valid
Target Language: English
File Format: PDF
Word Count: 8500 words
Translation Price(USD): 255.0
Delivery: via email in 1~3 business day
本文件规定了微电子器件假冒翻新物理特征识别方法与程序,包括外部特征分析、内部特征分析以及内部微观特征分析。
本文件适用于塑封及气密封装的微电子器件。
Code of China
Standard
T/CIE 152-2022  Test method and procedure for identification of physical characteristics of fake and counterfeit microelectronics devices (English Version)
Standard No.T/CIE 152-2022
Statusvalid
LanguageEnglish
File FormatPDF
Word Count8500 words
Price(USD)255.0
Implemented on
Deliveryvia email in 1~3 business day
Detail of T/CIE 152-2022
Standard No.
T/CIE 152-2022
English Name
Test method and procedure for identification of physical characteristics of fake and counterfeit microelectronics devices
Chinese Name
微电子器件假冒翻新物理特征识别方法与程序
Chinese Classification
L74
Professional Classification
T/
ICS Classification
Issued by
CIE
Issued on
2022-12-31
Implemented on
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
8500 words
Price(USD)
255.0
Keywords
T/CIE 152-2022, T/CIET 152-2022, TCIET 152-2022, T/CIE152-2022, T/CIE 152, T/CIE152, T/CIET152-2022, T/CIET 152, T/CIET152, TCIET152-2022, TCIET 152, TCIET152
Introduction of T/CIE 152-2022
本文件规定了微电子器件假冒翻新物理特征识别方法与程序,包括外部特征分析、内部特征分析以及内部微观特征分析。
本文件适用于塑封及气密封装的微电子器件。
Contents of T/CIE 152-2022
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Keywords:
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