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| T/CWAN 0005-2021 Recommended practice for reflow soldering of lead-free solder for rectifier devices (English Version) |
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Introduction of T/CWAN 0005-2021
本文件规定了整流器件用无铅钎料回流焊焊接推荐工艺规范。
本文件适用于厚度≤0.8 mm的金属铜回流焊。
Contents of T/CWAN 0005-2021