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| YS/T 1105-2016 Silver bonding wire for semiconductor package (English Version) |
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Detail of YS/T 1105-2016
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Introduction of YS/T 1105-2016
本标准规定了半导体分立器件、集成电路、LED封装用键合银丝的要求、试验方法、检验规则、标志、包装、运输和贮存质量证明书、订货单（或合同）等内容。
本标准适用于半导体封装用键合银丝。
Contents of YS/T 1105-2016