2026-2-11 10.1.71.44
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Code of China
Chinese National Standard List: Printed circuit

GB/T 33772.3-2025 Quality assessment systems—Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing 
  Issued on: 2025-12-31   Translation Price(USD): 660.0
GB/T 19405.4-2025 Surface mounting technology—Part 4: Classification; packaging; labelling and handling of moisture sensitive devices 
  Issued on: 2025-12-31   Translation Price(USD): 435.0
GB/T 46696-2025 Specification for permanent solder mask 
  Issued on: 2025-12-2   Translation Price(USD): 315.0
GB/T 46821-2025 Test methods for device embedded substrate 
  Issued on: 2025-12-31   Translation Price(USD): 645.0
GB/T 45723-2025 Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling 
  Issued on: 2025-05-30   Translation Price(USD): 210.0
GB/T 45714.54-2025 Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes 
  Issued on: 2025-05-30   Translation Price(USD): 375.0
GB/T 33772.2-2025 Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages 
  Issued on: 2025-05-30   Translation Price(USD): 315.0
GB/T 19405.3-2025 Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering 
  Issued on: 2025-04-25   Translation Price(USD): 375.0
GB/T 45713.4-2025 Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices 
  Issued on: 2025-05-30   Translation Price(USD): 645.0
GB/T 45660-2025 Electronics assembly technology—Electronic modules 
  Issued on: 2025-05-30   Translation Price(USD): 315.0
GB/T 44295-2024 Epoxide woven E-glass prepreg for multilayer printed boards 
  Issued on: 2024-8-23   Translation Price(USD): 435.0
T/CPCA 014-2024 Specification of OSP film for printed circuit board 
  Issued on: 2024-08-30   Translation Price(USD):
GB/T 43863-2024 Format for LSI—Package—Board interoperable design 
  Issued on: 2024-4-25   Translation Price(USD): 3225.0
GB/T 43799-2024 Sectional specification for high density interconnect printed boards 
  Issued on: 2024-3-15   Translation Price(USD): 510.0
GB/T 43801-2024 Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency—Split post dielectric resonator method 
  Issued on: 2024-3-15   Translation Price(USD): 375.0
GB/T 19247.6-2024 Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 
  Issued on: 2024-3-15   Translation Price(USD): 570.0
T/CPCA 013-2024 Tungsten carbide drills for printed boards 
  Issued on: 2024-03-28   Translation Price(USD):
T/CPCA 011-2023 Single & double-sided printed circuit board with carbon conductor 
  Issued on: 2023-06-28   Translation Price(USD):
T/CPCA 010-2023 Silver pasted through-hole printed circuit board 
  Issued on: 2023-05-05   Translation Price(USD):
T/CPCA 007-2022 Specification for printed circuit board with buried or embedded copper coin 
  Issued on: 2022-06-23   Translation Price(USD):
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