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| Position: Chinese Standard in English/GB/T 45713.4-2025 |
| GB/T 45713.4-2025 Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices (English Version) | |||
| Standard No.: | GB/T 45713.4-2025 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 21500 words | Translation Price(USD): | 645.0 remind me the price change |
| Implemented on: | 2025-9-1 | Delivery: | via email in 1~8 business day |
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| Standard No.: | GB/T 45713.4-2025 |
| English Name: | Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| Chinese Name: | 电子装联技术 第4部分：阵列型封装表面安装器件焊点的耐久性试验方法 |
| Chinese Classification: | L30 Printed circuit |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2025-05-30 |
| Implemented on: | 2025-9-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 21500 words |
| Translation Price(USD): | 645.0 |
| Delivery: | via email in 1~8 business day |