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| T/CPCA 014-2024 Specification of OSP film for printed circuit board (English Version) |
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Detail of T/CPCA 014-2024
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Introduction of T/CPCA 014-2024
本文件规定了沉积在印制电路板铜面上有机可焊保护膜（以下简称OSP膜）的性能要求、试验方法、质量保证、包装、运输和贮存等。
本文件仅适用于已沉积有机可焊保护膜的印制电路板，不适用于焊接过程或焊接后的印制电路板的鉴定。
Contents of T/CPCA 014-2024
