2025-12-24 10.8.118.215
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
SJ 21564-2020 Process requirements for adhesive bonding of military electronics assembly 225.0 via email in 1~3 business day valid,,2020-8-1
SJ 21558-2020 Test method for microvibration of stirling cryocooler 135.0 via email in 1~3 business day valid,,2020-8-1
SJ 21557-2020 Test method of X-ray non-destructive for PCB 150.0 via email in 1~3 business day valid,,2020-8-1
SJ 21556-2020 Requirement for traceability control of military printed circuit board manufacturing process 120.0 via email in 1~3 business day valid,,2020-8-1
SJ 21553-2020 Three-dimensional heterogeneous integration--Technical requirements for micro-bump with fine-pitch process 210.0 via email in 1~3 business day valid,,2020-8-1
SJ 21554-2020 Requirements of backdrill process control for printed circuit board 165.0 via email in 1~3 business day valid,,
SJ 21551-2020 General specification for high-power semiconductor laser chip 210.0 via email in 1~3 business day valid,,2020-8-1
SJ 21552-2020 High density functional substrate--Technical requirement for multilayer hybrid Integration process 210.0 via email in 1~3 business day valid,,2020-8-1
SJ 21549-2020 Data acq uisition and management requirement for surface assembly of military electronic equipment 195.0 via email in 1~3 business day valid,,2020-8-1
SJ 21550-2020 Test method for high speed signal transfer charactries of microelectronics ceramic packages 165.0 via email in 1~3 business day valid,,2020-8-1
SJ 21547-2020 Specification for automatic filling machine of infrared device manufacturing 270.0 via email in 1~3 business day valid,,2020-8-1
SJ 21548-2020 Test method of static strain gage for printed circuit board assemblies 345.0 via email in 1~5 business day valid,,2020-8-1
SJ 21546-2020 Specification for laser leveling flip-chip bonder of infrared device manufacturing 300.0 via email in 1~5 business day valid,,2020-8-1
SJ 21494.9-2020 Work safety standardization requirements of military electronics enterprises -Part9: Hazardous chemicals 555.0 via email in 1~5 business day valid,,2020-8-1
SJ 21494.14-2020 Work safety standardization requirements of military electronics enterprises——Part 14: Initiating explosive device 405.0 via email in 1~5 business day valid,,2020-8-1
SJ 21494.8-2020 Work safety standardization requirements of military electronics enterprises Part8: Electroplating and printed circuit board 585.0 via email in 1~5 business day valid,,2020-8-1
SJ 21494.12-2020 Work safety standardization requirements of military electronics enterprises ——Part12: Radiation 255.0 via email in 1~3 business day valid,,2020-8-1
SJ 21494.13-2020 Work safety standardization requirements of military electronics enterprises -Partl3:Power protection equipment and facilities 2000.0 via email in 1~10 business day valid,,2020-8-1
SJ 21494.11-2020 Work safety standardization requirements of military electronics enterprises -Part11: Mechanical processing 555.0 via email in 1~5 business day valid,,2020-8-1
SJ 21494.10-2020 Work safety standardization requirements of military electronics enterprises -Part10: Outfield test 600.0 via email in 1~5 business day valid,,
Previous Page     Next Page



Code of China
Search

SJ 21564-2020 Process requirements for adhesive bonding of military electronics assembly  
  Issued on: 2020-06-03   Price(USD): 225.0
SJ 21558-2020 Test method for microvibration of stirling cryocooler  
  Issued on: 2020-06-03   Price(USD): 135.0
SJ 21557-2020 Test method of X-ray non-destructive for PCB  
  Issued on: 2020-06-03   Price(USD): 150.0
SJ 21556-2020 Requirement for traceability control of military printed circuit board manufacturing process  
  Issued on: 2020-06-03   Price(USD): 120.0
SJ 21553-2020 Three-dimensional heterogeneous integration--Technical requirements for micro-bump with fine-pitch process  
  Issued on: 2020-06-03   Price(USD): 210.0
SJ 21554-2020 Requirements of backdrill process control for printed circuit board  
  Issued on: 2020-06-03   Price(USD): 165.0
SJ 21551-2020 General specification for high-power semiconductor laser chip  
  Issued on: 2020-06-03   Price(USD): 210.0
SJ 21552-2020 High density functional substrate--Technical requirement for multilayer hybrid Integration process  
  Issued on: 2020-06-03   Price(USD): 210.0
SJ 21549-2020 Data acq uisition and management requirement for surface assembly of military electronic equipment  
  Issued on: 2020-06-03   Price(USD): 195.0
SJ 21550-2020 Test method for high speed signal transfer charactries of microelectronics ceramic packages  
  Issued on: 2020-06-03   Price(USD): 165.0
SJ 21547-2020 Specification for automatic filling machine of infrared device manufacturing  
  Issued on: 2020-06-03   Price(USD): 270.0
SJ 21548-2020 Test method of static strain gage for printed circuit board assemblies  
  Issued on: 2020-06-03   Price(USD): 345.0
SJ 21546-2020 Specification for laser leveling flip-chip bonder of infrared device manufacturing  
  Issued on: 2020-06-03   Price(USD): 300.0
SJ 21494.9-2020 Work safety standardization requirements of military electronics enterprises -Part9: Hazardous chemicals  
  Issued on: 2020-06-03   Price(USD): 555.0
SJ 21494.14-2020 Work safety standardization requirements of military electronics enterprises——Part 14: Initiating explosive device  
  Issued on: 2020-06-03   Price(USD): 405.0
SJ 21494.8-2020 Work safety standardization requirements of military electronics enterprises Part8: Electroplating and printed circuit board  
  Issued on: 2020-06-03   Price(USD): 585.0
SJ 21494.12-2020 Work safety standardization requirements of military electronics enterprises ——Part12: Radiation  
  Issued on: 2020-06-03   Price(USD): 255.0
SJ 21494.13-2020 Work safety standardization requirements of military electronics enterprises -Partl3:Power protection equipment and facilities  
  Issued on: 2020-06-03   Price(USD): 2000.0
SJ 21494.11-2020 Work safety standardization requirements of military electronics enterprises -Part11: Mechanical processing  
  Issued on: 2020-06-03   Price(USD): 555.0
SJ 21494.10-2020 Work safety standardization requirements of military electronics enterprises -Part10: Outfield test  
  Issued on: 2020-06-03   Price(USD): 600.0
About Us   |    Contact Us   |    Terms of Service   |    Privacy   |    Cancellation & Refund Policy   |    Payment
Tel: +86-10-8572 5655 | Fax: +86-10-8581 9515 | Email: coc@codeofchina.com | QQ: 672269886
Copyright: Beijing COC Tech Co., Ltd. 2008-2040