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| Position: Chinese Standard in English/GB 10243-1988 |
| GB 10243-1988 prepreg for use as bonding sheet material in the fabrication of multilayer printed boards (English Version) | |||
| Standard No.: | GB 10243-1988 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 3500 words | Translation Price(USD): | 100.0 remind me the price change |
| Implemented on: | 1989-7-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB 10243-1988 |
| English Name: | prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| Chinese Name: | 多层印制板用粘结片预浸材料 |
| Chinese Classification: | L30 Printed circuit |
| Professional Classification: | GB National Standard |
| Implemented on: | 1989-7-1 |
| Status: | superseded |
| Superseded by: | SJ/T 11050-1996 prepreg for use as bonding sheet material in the fabrication of multilayer printed boards JB 8202-1995 |
| Superseded on: | 2000-1-1 |
| Target Language: | English |
| File Format: | |
| Word Count: | 3500 words |
| Translation Price(USD): | 100.0 |
| Delivery: | via email in 1~3 business day |