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| Position: Chinese Standard in English/GB/T 26070-2010 |
| GB/T 26070-2010 Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method (English Version) | |||
| Standard No.: | GB/T 26070-2010 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 8000 words | Translation Price(USD): | 240.0 remind me the price change |
| Implemented on: | 2011-10-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 26070-2010 |
| English Name: | Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method |
| Chinese Name: | 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
| Chinese Classification: | H17 Semimetal and semiconductor material analysis method |
| Professional Classification: | GB National Standard |
| ICS Classification: | 77.040.99 Other methods of testing of metals |
| Source Content Issued by: | AQSIQ |
| Issued on: | 2011-1-10 |
| Implemented on: | 2011-10-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 8000 words |
| Translation Price(USD): | 240.0 |
| Delivery: | via email in 1~3 business day |