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| Position: Chinese Standard in English/GB/T 31474-2015 |
| GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly (English Version) | |||
| Standard No.: | GB/T 31474-2015 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 10500 words | Translation Price(USD): | 310.0 remind me the price change |
| Implemented on: | 2016-1-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 31474-2015 |
| English Name: | Soldering fluxes for high-quality interconnections in electronics assembly |
| Chinese Name: | 电子装联高质量内部互连用助焊剂 |
| Chinese Classification: | H21 Metal physical property test method |
| Professional Classification: | GB National Standard |
| ICS Classification: | 29.045 Semiconducting materials |
| Source Content Issued by: | AQSIQ; SAC |
| Issued on: | 2015-05-15 |
| Implemented on: | 2016-1-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 10500 words |
| Translation Price(USD): | 310.0 |
| Delivery: | via email in 1~5 business day |