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| GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits (English Version) |
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Detail of GB/T 43538-2023
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Introduction of GB/T 43538-2023
本文件规定了集成电路金属封装外壳的材料、镀覆、设计和结构、电特性、外观质量及环境适应性等方面的技术要求和检验方法。
本文件适用于集成电路金属封装外壳（以下简称“外壳”）的研制、生产、交付和使用。
Contents of GB/T 43538-2023