Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
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Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 14862-1993 - To - Case thermal resistance test methods of packages for semiconductor integrated circuits 150.0 via email in 1~3 business day valid
SJ/T 10805-2000 Semiconductor integrated circuits - General principles of measuring methods for voltage comparators 390.0 via email in 1~3 business day valid
GB/T 14028-1992 principles of measuring methods of analogue switches for semiconductor integrated circuits 240.0 via email in 1~3 business day valid
GB/T 16464-1996 Semiconductor devices Integrated circuits Part 1: General 240.0 via email in 1~3 business day valid
SJ 20802-2001 Visual inspection criteria for integrated circuits metal packages 300.0 via email in 1~5 business day valid
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS 320.0 via email in 1~5 business day valid
GB/T 14032-1992 principles of measuring methods of digital phase - Locked loop for semiconductor integrated circuits 120.0 via email in 1~3 business day valid
GB/T 26112-2010 Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters 240.0 via email in 1~3 business day valid
GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits 300.0 via email in 1~3 business day valid
GB/T 32816-2016 Silicon-based MEMS manufacturing technology to deep etch and bonding as the core of the process integration specification 275.0 via email in 1~3 business day valid
GB/T 20296-2012 Mnemonics and symbols for integrated circuits 430.0 via email in 1~3 business day valid
GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure 120.0 via email in 1~3 business day valid
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area 310.0 via email in 1~3 business day valid
GB/T 8976-1996 Generic specification for film integrated circuits and hybrid film integrated circuits 300.0 via email in 1~3 business day valid
GB/T 15878-1995 Specification of leadframes for small outline package 75.0 via email in 1~3 business day superseded
GB/T 17023-1997 Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74 285.0 via email in 1~3 business day valid
GB/T 26111-2010 Micro-electromechanical system technology—Terms 570.0 via email in 1~3 business day valid
GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits 140.0 via email in 1~3 business day valid
GB 9178-1988 Terminology for integrated circuits 1200.0 via email in 1~3 business day valid
SJ 20954-2006 Integrated circuits latch-up test 225.0 via email in 1~3 business day valid
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