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Position: Chinese Standard in English/GB/T 44796-2024
GB/T 44796-2024   Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation (English Version)
Standard No.: GB/T 44796-2024 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 7500 words Translation Price(USD):225.0 remind me the price change

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Implemented on:2025-5-1 Delivery: via email in 1~3 business day

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,,2025-5-1,B066F271D445D48A1730452180476
Standard No.: GB/T 44796-2024
English Name: Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
Chinese Name: 集成电路三维封装 带凸点圆片划片工艺过程和评价要求
Chinese Classification: L55    Microcircuit in general
Professional Classification: GB    National Standard
Source Content Issued by: SAMR; SAC
Issued on: 2024-10-26
Implemented on: 2025-5-1
Status: valid
Target Language: English
File Format: PDF
Word Count: 7500 words
Translation Price(USD): 225.0
Delivery: via email in 1~3 business day
本文件规定了12 in及以下尺寸集成电路三维封装带凸点圆片划片工艺(以下简称划片工艺)的一般要求、详细要求和评价要求。
注: 1 in=2.54 cm。
本文件适用于12 in及以下尺寸集成电路三维封装带凸点圆片划片工艺。
Code of China
Standard
GB/T 44796-2024  Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation (English Version)
Standard No.GB/T 44796-2024
Statusvalid
LanguageEnglish
File FormatPDF
Word Count7500 words
Price(USD)225.0
Implemented on2025-5-1
Deliveryvia email in 1~3 business day
Detail of GB/T 44796-2024
Standard No.
GB/T 44796-2024
English Name
Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
Chinese Name
集成电路三维封装 带凸点圆片划片工艺过程和评价要求
Chinese Classification
L55
Professional Classification
GB
ICS Classification
Issued by
SAMR; SAC
Issued on
2024-10-26
Implemented on
2025-5-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
7500 words
Price(USD)
225.0
Keywords
GB/T 44796-2024, GB 44796-2024, GBT 44796-2024, GB/T44796-2024, GB/T 44796, GB/T44796, GB44796-2024, GB 44796, GB44796, GBT44796-2024, GBT 44796, GBT44796
Introduction of GB/T 44796-2024
本文件规定了12 in及以下尺寸集成电路三维封装带凸点圆片划片工艺(以下简称划片工艺)的一般要求、详细要求和评价要求。
注: 1 in=2.54 cm。
本文件适用于12 in及以下尺寸集成电路三维封装带凸点圆片划片工艺。
Contents of GB/T 44796-2024
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Keywords:
GB/T 44796-2024, GB 44796-2024, GBT 44796-2024, GB/T44796-2024, GB/T 44796, GB/T44796, GB44796-2024, GB 44796, GB44796, GBT44796-2024, GBT 44796, GBT44796