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| Position: Chinese Standard in English/GB/T 8750-2014 |
| GB/T 8750-2014 Gold bonding wire for semiconductor package (English Version) | |||
| Standard No.: | GB/T 8750-2014 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 12500 words | Translation Price(USD): | 370.0 remind me the price change |
| Implemented on: | 2015-2-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 8750-2014 |
| English Name: | Gold bonding wire for semiconductor package |
| Chinese Name: | 半导体封装用键合金丝 |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | AQSIQ; SAC |
| Issued on: | 2014-07-24 |
| Implemented on: | 2015-2-1 |
| Status: | superseded |
| Superseded by: | GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package |
| Superseded on: | 2023-7-1 |
| Superseding: | GB/T 8750-2007 Gold bonding wire for semiconductor devices |
| Target Language: | English |
| File Format: | |
| Word Count: | 12500 words |
| Translation Price(USD): | 370.0 |
| Delivery: | via email in 1~5 business day |