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| Position: Chinese Standard in English/GB/T 8750-2022 |
| GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package (English Version) | |||
| Standard No.: | GB/T 8750-2022 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 14000 words | Translation Price(USD): | 420.0 remind me the price change |
| Implemented on: | 2023-7-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 8750-2022 |
| English Name: | Gold-based bonding wire and bandlet for semiconductor package |
| Chinese Name: | 半导体封装用金基键合丝、带 |
| Chinese Classification: | H68 Precious metals and their alloys |
| Professional Classification: | GB National Standard |
| ICS Classification: | 77.150.99 Other products of non-ferrous metals |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2022-12-30 |
| Implemented on: | 2023-7-1 |
| Status: | valid |
| Superseding: | GB/T 8750-2014 Gold bonding wire for semiconductor package |
| Target Language: | English |
| File Format: | |
| Word Count: | 14000 words |
| Translation Price(USD): | 420.0 |
| Delivery: | via email in 1~5 business day |