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Standard
| GB/Z 43510-2023 Integrated circuit TSV 3D package reliability test methods guideline (English Version) |
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Detail of GB/Z 43510-2023
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Introduction of GB/Z 43510-2023
本文件提供了硅通孔（TSV）三维封装的工艺开发验证用可靠性试验方法指南。
本文件适用于采用先通孔、中通孔以及后通孔三种工艺流程制造的TSV三维封装的工艺验证试验。
Contents of GB/Z 43510-2023