2025-12-5 10.1.6.65
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Position: Chinese Standard in English/GB/T 12965-2005
GB/T 12965-2005   Monocrystalline silicon as cut slices and lapped slices (English Version)
Standard No.: GB/T 12965-2005 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 4000 words Translation Price(USD):120.0 remind me the price change

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Implemented on:2006-4-1 Delivery: via email in 1~3 business day

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,2019-6-1,2006-4-1,1411381818076608519DE36FA5967
Standard No.: GB/T 12965-2005
English Name: Monocrystalline silicon as cut slices and lapped slices
Chinese Name: 硅单晶切割片和研磨片
Chinese Classification: H82    Elemental semiconductor material
Professional Classification: GB    National Standard
ICS Classification: 29.045 29.045    Semiconducting materials 29.045
Source Content Issued by: AQSIQ;SAC
Issued on: 2005-9-19
Implemented on: 2006-4-1
Status: superseded
Superseded by:GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
Superseded on:2019-6-1
Superseding:GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices
Target Language: English
File Format: PDF
Word Count: 4000 words
Translation Price(USD): 120.0
Delivery: via email in 1~3 business day
本标准规定了硅单晶切割片和研磨石的产品分类、术语、技术要求、试验方法、检验规则以及标志、包装、运输、贮存等。本标准适用于由直接、悬浮区熔和中子嬗变掺杂硅单晶经切割、双面研磨制备的圆形硅片。产品主要用于制作晶体管、整流器件等半导体器件,或进一步加工成抛光片。
Code of China
Standard
GB/T 12965-2005  Monocrystalline silicon as cut slices and lapped slices (English Version)
Standard No.GB/T 12965-2005
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count4000 words
Price(USD)120.0
Implemented on2006-4-1
Deliveryvia email in 1~3 business day
Detail of GB/T 12965-2005
Standard No.
GB/T 12965-2005
English Name
Monocrystalline silicon as cut slices and lapped slices
Chinese Name
硅单晶切割片和研磨片
Chinese Classification
H82
Professional Classification
GB
ICS Classification
Issued by
AQSIQ;SAC
Issued on
2005-9-19
Implemented on
2006-4-1
Status
superseded
Superseded by
GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
Superseded on
2019-6-1
Abolished on
Superseding
GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices
Language
English
File Format
PDF
Word Count
4000 words
Price(USD)
120.0
Keywords
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Introduction of GB/T 12965-2005
本标准规定了硅单晶切割片和研磨石的产品分类、术语、技术要求、试验方法、检验规则以及标志、包装、运输、贮存等。本标准适用于由直接、悬浮区熔和中子嬗变掺杂硅单晶经切割、双面研磨制备的圆形硅片。产品主要用于制作晶体管、整流器件等半导体器件,或进一步加工成抛光片。
Contents of GB/T 12965-2005
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Keywords:
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