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Title Standard No. Implemented On
Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuitsGB/T 15879.5-20182019-4-1
Integrated circuits—Memory devices pin configurationGB/T 36614-20182019-1-1
Test methods for flip chip integrated circuitsGB/T 35005-20182018-8-1
Semiconductor die products—Part 8:EXPRESS model schema for data exchangeGB/T 35010.8-20182018-8-1
Semiconductor die products—Part 1:Requirements for procurement and useGB/T 35010.1-20182018-8-1
Semiconductor die products—Part 7:XML schema for data exchangeGB/T 35010.7-20182018-8-1
Semiconductor die products—Part 5:Requirements for concerning electrical simulationGB/T 35010.5-20182018-8-1
Semiconductor die products—Part 4: Requirements for die users and suppliersGB/T 35010.4-20182018-8-1
Semiconductor die products—Part 3: Guide for handling, packing and storageGB/T 35010.3-20182018-8-1
Semiconductor die products—Part 2:Exchange data formatsGB/T 35010.2-20182018-8-1
Semiconductor die products—Part 6:Requirements for concerning thermal simulationGB/T 35010.6-20182018-8-1
Test methods of the performance for MEMS high g accelerometerGB/T 33929-20172018-2-1
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performancesGB/T 33922-20172018-2-1
Silicon-based MEMS fabrication technology - Specification for criterion of the bulk silicon piezoresistance processGB/T 32815-20162017-3-1
Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMSGB/T 32817-20162017-3-1
Fabrication Technology of Silicon Based MEMS Process Specification Based on SOI SiliconGB/T 32814-20162017-3-1
Silicon-based MEMS manufacturing technology to deep etch and bonding as the core of the process integration specificationGB/T 32816-20162017-3-1
Mnemonics and symbols for integrated circuitsGB/T 20296-20122013-7-1
Silicon-based MEMS fabrication technology—Specification for dissolved wafer processGB/T 28276-20122012-12-1
Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding areaGB/T 28277-20122012-12-1
Silicon-based MEMS fabrication technology—The basic regulation of layout designGB/T 28274-20122012-12-1
Silicon-based MEMS fabrication technology—Specification for KOH etch processGB/T 28275-20122012-12-1
Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parametersGB/T 26112-20102011-10-1
Micro-electromechanical system technology—TermsGB/T 26111-20102011-10-1
Micro-electromechanical system technology—General rules for the assessment of micro-geometrical parametersGB/T 26113-20102011-7-1
Integrated circuits latch-up testSJ 20954-20062006-12-30
General principles of measuring methods of A/D and D/A converters for integrated circuitsSJ 20961-20062006-12-30
Microwave circuits - Measuring methods for frequency convertersSJ 20938-20052006-6-1
Test method for measuring the resistance of package leadsGB/T 19248-20032003-10-1
Visual inspection criteria for integrated circuits metal packagesSJ 20802-20012002-1-1
Semiconductor integrated circuits - General principles of measuring methods for voltage comparatorsSJ/T 10805-20002001-3-1
Application Specifications for Integrated Circuit (IC) Card of Sinopec (V1.0 Edition)ZBBZH/ZS2000-11-1
Semiconductor devices --Integrated circuits Part 2:Digital integrated circuitsGB/T 17574-19981999-6-1
Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74GB/T 17023-19971998-9-1
Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCUGB/T 17024-19971998-9-1
Specification of leadframes for plastic leaded chip carrier packagesGB/T 16525-19961997-5-1
The method measuring the lead-to-lead and loading capacitance of package leadsGB/T 16526-19961997-5-1
Generic specification for film integrated circuits and hybrid film integrated circuitsGB/T 8976-19961997-1-1
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresGB/T 16466-19961997-1-1
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresGB/T 16465-19961997-1-1
Semiconductor devices Integrated circuits Part 1: GeneralGB/T 16464-19961997-1-1
Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuitsGB/T 15879-19951996-8-1
Specification of leadframes for plastic quad flat packageGB/T 15876-19951996-8-1
Specification of leadframes for small outline packageGB/T 15878-19951996-8-1
Mechanical and climatic test methods for microcircuit modulesGB/T 15297-19941995-7-1
Case outlines for film integrated circuits and hybrid integrated circuitsGB/T 15138-19941995-4-1
- To - Case thermal resistance test methods of packages for semiconductor integrated circuitsGB/T 14862-19931994-9-1
Semiconductor integrated circuits-Specification for stamped leadframes of plastic DIPGB/T 14112-19931993-8-1
principles of measuring methods of analogue switches for semiconductor integrated circuitsGB/T 14028-19921993-8-1
principles of measuring methods of digital phase - Locked loop for semiconductor integrated circuitsGB/T 14032-19921993-8-1
principles of measruing methods of analogue phase - Loop for semiconductor integrated circuitsGB/T 14031-19921993-8-1
principles of measuring methods of timer circuits for semiconductor integrated circuitsGB/T 14030-19921993-8-1
of packages for semiconductor integrated circuitsGB/T 14113-19931993-8-1
principles of measuring methods of analogue multiplier for semiconductor integrated circuitsGB/T 14029-19921993-8-1
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedureGB/T 13062-19911992-3-1
General principle of measuring methods of microprocessors and peripheral interface circuit parameters for semiconductor integrated circuitsGB/T 12843-19911991-1-2
Terminology for film integrated circuits and hybrid film integrated circuitsGB/T 12842-19911991-1-2
Sectional specification for semiconductor integrated circuits, excluding hybrid circuitsGB/T 12750-19911991-1-1
Basic environmental testing procedures for nonbroadcasting video cassette tape recordersGB 12199-19901990-8-1
Terminology for integrated circuitsGB 9178-19881988-10-1
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