2025-12-5 10.1.6.65
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
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Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 46567.1-2025 Intelligent computing - Test method for memristor - Part 1: Basic characteristics 240.0 via email in 1~3 business day valid,,2025-10-31
GB/T 44849-2024 Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials 375.0 via email in 1~5 business day valid,,2025-5-1
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films 270.0 via email in 1~3 business day valid,,2025-4-1
GB/T 44839-2024 Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials 270.0 via email in 1~3 business day valid,,2025-2-1
GB/T 44513-2024 Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application 315.0 via email in 1~5 business day valid,,2025-1-1
GB/T 44515-2024 Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film 315.0 via email in 1~5 business day valid,,2025-1-1
GB/T 44842-2024 Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials 270.0 via email in 1~3 business day valid,,2024-10-26
GB/T 44529-2024 Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators 510.0 via email in 1~5 business day valid,,2024-9-29
GB/T 44514-2024 Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials 270.0 via email in 1~3 business day valid,,2024-9-29
GB/T 43493.2-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection 375.0 via email in 1~3 business day valid,,2024-7-1
GB/T 43493.3-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence 375.0 via email in 1~3 business day valid,,2024-7-1
GB/T 43493.1-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects 375.0 via email in 1~3 business day valid,,2024-7-1
GB/T 15651.6-2023 Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes 1170.0 via email in 1~5 business day valid,,2024-4-1
T/SLEIA 0004-2024 via email in business day valid,,2024-2-26
GB/T 26111-2023 Micro-electromechanical system technology—Terms 585.0 via email in 1~5 business day valid,,2023-9-1
GB/T 42597-2023 Micro-electromechanical systems technology—Gyroscopes 675.0 via email in 1~5 business day valid,,2023-9-1
GB/T 42191-2023 Test methods of the performances for MEMS piezoresistive pressure-sensitive device 255.0 via email in 1~3 business day valid,,2023-9-1
GB/T 42158-2023 Micro-electromechanical systems technology(MEMS)―Description and measurement methods for micro trench and pyramidal needle structures 375.0 via email in 1~5 business day valid,,2023-7-1
GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures 225.0 via email in 1~3 business day valid,,2022-10-12
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 315.0 via email in 1~5 business day valid,,2022-10-12
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GB/T 46567.1-2025 Intelligent computing - Test method for memristor - Part 1: Basic characteristics 
  Issued on: 2025-10-31   Price(USD): 240.0
GB/T 44849-2024 Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials 
  Issued on: 2024-10-26   Price(USD): 375.0
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films 
  Issued on: 2024-09-29   Price(USD): 270.0
GB/T 44839-2024 Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials 
  Issued on: 2024-10-26   Price(USD): 270.0
GB/T 44513-2024 Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application 
  Issued on: 2024-09-29   Price(USD): 315.0
GB/T 44515-2024 Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film 
  Issued on: 2024-09-29   Price(USD): 315.0
GB/T 44842-2024 Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials 
  Issued on: 2024-10-26   Price(USD): 270.0
GB/T 44529-2024 Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators 
  Issued on: 2024-09-29   Price(USD): 510.0
GB/T 44514-2024 Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials 
  Issued on: 2024-09-29   Price(USD): 270.0
GB/T 43493.2-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection 
  Issued on: 2023-12-28   Price(USD): 375.0
GB/T 43493.3-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence 
  Issued on: 2023-12-28   Price(USD): 375.0
GB/T 43493.1-2023 Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects 
  Issued on: 2023-12-28   Price(USD): 375.0
GB/T 15651.6-2023 Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes 
  Issued on: 2023-9-7   Price(USD): 1170.0
T/SLEIA 0004-2024  
  Issued on: 2024-01-26   Price(USD):
GB/T 26111-2023 Micro-electromechanical system technology—Terms  
  Issued on: 2023-05-23   Price(USD): 585.0
GB/T 42597-2023 Micro-electromechanical systems technology—Gyroscopes 
  Issued on: 2023-05-23   Price(USD): 675.0
GB/T 42191-2023 Test methods of the performances for MEMS piezoresistive pressure-sensitive device  
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 42158-2023 Micro-electromechanical systems technology(MEMS)―Description and measurement methods for micro trench and pyramidal needle structures 
  Issued on: 2023-03-17   Price(USD): 375.0
GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures 
  Issued on: 2022-10-12   Price(USD): 225.0
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 
  Issued on: 2022-10-12   Price(USD): 315.0
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